XCZU6EG-1FFVB1156I
- Manufacturer No:
- XCZU6EG-1FFVB1156I
- Manufacturer:
- Xilinx Inc.
- Product Category:
- Embedded - System On Chip (SoC)
- Description:
- IC FPGA 328 I/O 1156FCBGA
- RoHs Status:
Lead Free / RoHS Compliant
- Datasheet:
-
XCZU6EG-1FFVB1156I Datasheet(PDF)
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Purchase Instructions
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DHL Express | International Shipping, on time, every time. DHL Express is a division of the German logistics company Deutsche Post DHL providing international express mail services. Deutsche Post is the world's largest logistics company operating around the world. DHL is a world market leader in sea and air mail. |
United Parcel Service | United Parcel Service of North America, Inc., typically referred to and branded as UPS (stylized as ups), is the largest shipment and logistics company in the world. The American global package delivery company is headquartered in Sandy Springs, Georgia, which is part of the Greater Atlanta metropolitan area. UPS delivers more than 15 million packages a day to more than 6.1 million customers in more than 220 countries and territories around the world. |
Fedex Corporation | FedEx Corporation is an American global courier delivery services company headquartered in Memphis, Tennessee. The name "FedEx" is a syllabic abbreviation of the name of the company's original air division, Federal Express, which was used from 1973 until 2000. |
Express Mail Service | EMS is an international postal Express Mail Service, for documents and merchandise, offered by postal operators of the Universal Postal Union. Approved by the State Council, China Postal Express & Logistics Co., Ltd. (“China Postal Express & Logistics”) was co-founded by China Post Group and provincial postal companies as a state-owned limited company in June 2010. The company is the largest integrated express and logistics service provider with the longest history of business operation, the widest coverage and the richest products in China. |
Specifications
| Product Category : | Embedded - System On Chip (SoC) | Manufacturer : | Xilinx Inc. |
| Architecture : | MCU, FPGA | Connectivity : | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Core Processor : | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Flash Size : | - |
| Operating Temperature : | -40°C ~ 100°C (TJ) | Package / Case : | 1156-BBGA, FCBGA |
| Packaging : | Tray | Part Status : | Active |
| Peripherals : | DMA, WDT | Primary Attributes : | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| RAM Size : | 256Kb | Series : | Zynq® UltraScale+™ MPSoC EG |
| Speed : | 600MHz, 1.5GHz | Supplier Device Package : | 1156-FCBGA (35x35) |
Inventory Quantity: 922
MOQ: 1
Popular parts number
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